Multi-Tool Functionality
As either a standalone gage, or with its optional cassette handler, the 9500 UltraGage site measurement tool offers a variety of measurements not usually found in a single tool. Wafer thickness, shape stress measurements, global and site flatness measurements can be used in many applications from incoming quality control to backgrind. Moreover, stress measurement and off-line analysis software can be added eliminating the need to purchase a separate stress measurement tool.
Site Flatness Measurement
Standard on the 9500 UltraGage site measurement tool, real time site flatness measurements can be used to qualify wafers for their suitability for lithographic processes. Site size and offset can be varied to qualify the site flatness measurements of user specific image layouts, preventing out of specification wafers from entering the IC fabrication process.
Stress Measurements
The 9500 UltraGage site measurement tool’s optional stress measurement is not sensitive to film type, reflectivity or other optical aberrations found in optically based stress measurement systems. The large number of data points results in highly detailed stress measurements to within 3 mm from the edge.