Краткие технические характеристики:
- Provides 2x improvement in throughput over previous generation tool
- Uses UV and visible light source and 0.12-mm pixel size to provide the improved inspection sensitivity needed for 65-nm node and below design rules
- Delivers superior resolution and material contrast through selectable illumination (broadband UV, broadband visible, i-line, and g-line) and a high numerical aperture, enabling inspection of all process layers with full sensitivity to the entire range of defects
- Enables superior color noise suppression through broadband illumination for ideal inspection monitoring of BEOL metal etch and copper CMP layers
- Accelerates time to classified results and improves yield with inline automatic defect classification (iADC) and rule-based binning capability
- Enhances return on investment in 300-mm manufacturing equipment with SEMI 300-mm automation-standards compliance
- Provides 235x capital-investment extension through upgrade capability