Краткие технические характеристики:
- Uses a shorter wavelength light source and smaller pixel size to provide the improved imaging inspection sensitivity needed for 90-nm node and below design rules
- Selectable UV illumination (Broadband UV, I-Line and G-Line) combines with high numerical aperture to deliver superior resolution and material contrast, enabling inspection of all process layers with full sensitivity to the entire range of defects
- UV illumination provides superior color noise suppression for ideal imaging inspection monitoring of BEOL metal etch and copper CMP layers
- Accelerates time to classified results and improves yield with Inline Automatic Defect Classification (iADC)
- Enhances return on investment in 300-mm manufacturing equipment with SEMI 300-mm automation-standards compliance
- Includes 235x capital-investment extension through upgrade capability